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z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) rev. 00 rev. 00 september 2010 september 2010 www.seoulsemicon.com www.seoulsemicon.com specification UPGT801-S ssc customer drawn approval approval
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) rev. 00 rev. 00 september 2010 september 2010 www.seoulsemicon.com www.seoulsemicon.com UPGT801-S 1. features 2. absolute maximum ratings 3. electro characteristics 4. optical characteristics 5. color & binning 6. outline dimension 7. packing 8. soldering 9. precaution for use 10. handling of silicone resin leds
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) rev. 00 rev. 00 september 2010 september 2010 www.seoulsemicon.com www.seoulsemicon.com UPGT801-S features applications this surface-mount led comes in plcc standard package dimension. it has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. the die is attached within the reflector cavity and the cavity is encaps ulated by epoxy or silicone the package design coupled with careful selection of component materials allow these products to perform with high reliability in a larger temperature range -40 to 100 . the high reliability feature is crucial to automotive interior and indoor ess. description UPGT801-S ?? ? industry standard plcc smt package ? high brightness using alingap and ingan dice technologies ? available in multiple colors ? high volume, high reliability ? interior automotive ? electronic signs and signals ? office automation, electrical appliances, industrial equipment
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) rev. 00 rev. 00 september 2010 september 2010 www.seoulsemicon.com www.seoulsemicon.com 1. features ? green colored smt package ? material alingap ? suitable for all smt assembly methods suitable for all soldering methods ? rohs compliant
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) rev. 00 rev. 00 september 2010 september 2010 www.seoulsemicon.com www.seoulsemicon.com 2. absolute maximum ratings parameter symbol value unit power dissipation p d 123 mw forward current i f 30 ma peak forward current i fm *2 90 ma reverse voltage v r 5 v operating temperature t opr -40 ~ +100 o c storage temperature t stg -40 ~ +100 o c 3. electric characteristics *1. the luminous intensity iv was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the led package. luminous intensity measurement allowance is 10% *2. 2 ? is the off-axis where the luminous intensity is 1/2 of the peak intensity. parameter symbol condition min typ max unit forward voltage v f i f =20ma 1.7 2.2 2.7 v reverse current i r v r =5v - - 10 a luminance intensity *1 i v i f =20ma 12 17 36 mcd peak wavelength p i f =20ma - 557 - nm dominant wavelength d i f =20ma 554 562 567 nm spectral bandwidth 50% ? i f =20ma - 30 - nm viewing angle *2 2 ? i f =20ma - 120 - deg. [1] care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. [2] i fm was measured at tw 1 msec of pulse width and d 1/10 of duty ratio. [3] led?s properties might be different from suggested values like above and below tables if operation condition will be exceeded our parameter range.
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) rev. 00 rev. 00 september 2010 september 2010 www.seoulsemicon.com www.seoulsemicon.com 1.71.81.92.02.12.22.32.4 10 0 10 1 10 2 0 5 10 15 20 25 30 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 4. optical characteristics ( t a =25 o c ) forward current vs. forward voltage relative luminous intensity vs forward current ( t a =25 o c ) forward voltage v f (v) forward current i f [ma] forward current i f [ma] radiation diagram forward current derating curve -40 -20 0 20 40 60 80 100 120 0 10 20 30 40 ambient temperature t a [ o c ] forward current i f [ma] ( t a =25 o c ) -90 -60 -30 90 60 30 0 relative luminous intensity iv/iv [rel]
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) rev. 00 rev. 00 september 2010 september 2010 www.seoulsemicon.com www.seoulsemicon.com 5. color & binning rank name vf [v] iv [mcd] wd [nm] a 1.7 ~ 2.7 12 ~ 20 554 ~ 556 b 556 ~ 558 c 558 ~ 560 d 560 ~ 562 e 12 ~ 17 562 ~ 564 f 564 ~ 567 g 20 ~ 28 554 ~ 556 h 556 ~ 558 i 558 ~ 560 j 560 ~ 561 k 17 ~ 28 561 ~ 564 l 564 ~ 567 m 28 ~ 36 554 ~ 556 n 556 ~ 558 o 558 ~ 560 p 560 ~ 562 q 562 ~ 564 r 564 ~ 567 UPGT801-S binning [note] all measurements were made under the standardized enviro nment of ssc.
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) rev. 00 rev. 00 september 2010 september 2010 www.seoulsemicon.com www.seoulsemicon.com 6.outline dimension 7. packing 3.830.1 5 80.1 1.750.1 3.50.1 8 1.00.1 3.10.1 2.00.05 4.00.1 1.55 0.05 0.220.05 2.220.1 0.2 2.0 60 30 -3 +0 0.2 lable 11.4 0.3 9.0 0.1 180 13 10 22 (1) quantity : 2000pcs/reel (2) cumulative tolerance : cumulative tolerance/10 pitches to be 0.2mm (3) adhesion strength of cover tape : adhesion strength to be 0. 1-0.7n when the cover tape is turned off from the carrier tape at the angle of 10o to the carrier tape (4) package : p/n, manufacturing data code no. and quantity to be indicated on a damp proof package ( tolerance: 0.2, unit: mm ) 2.8 2.2 3.2 2.4 1.6 0.8 1.9 0.8 0.15 cathode mark anode cathode recommended solder pattern 1.6 2.2 1.8 1.8
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) rev. 00 rev. 00 september 2010 september 2010 www.seoulsemicon.com www.seoulsemicon.com reel packing structure c a b 1 side 7inch 245 220 142 size (mm) outer box structure material : paper(sw3b(b)) type a b c 1 humidity indicator aluminum vinyl bag reel desi pak part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. rohs
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) rev. 00 rev. 00 september 2010 september 2010 www.seoulsemicon.com www.seoulsemicon.com 8. soldering lead solder pre-heat 120~150 pre-heat time 120 sec. max. peak-temperature 240 max. soldering time condition 10 sec. max. lead free solder pre-heat 150~200 pre-heat time 120 sec. max. peak-temperature 260 max. soldering time condition 10 sec. max. lead solder 2.5~5 c / sec. o o o pre-heating 120~150 c 120sec. max. 60sec. max. above 200 c o 240 c max. 10 sec. max. 2.5~5 c / sec. (1) lead solder (2) lead-free solder le ad- free solder 1~5 c / sec. o o o o 1~5 c / sec. pre-heating 150~200 c 120sec. max. 60sec. max. above 220 c o 260 c max. 10 sec. max. (3) hand soldering conditions do not exceed 4 seconds at maximum 315oc under soldering iron. (4) the encapsulated material of the leds is silicone. precautions should be taken to avoid the strong pressure on the encapsulated part. so when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. (5) it is recommended that the customer use the nitrogen reflow method. (6) repairing should not be done after the leds have been soldered. (7) reflow soldering should not be done more than two times. in the case of more than 24 hours passed soldering after first, leds will be damaged.
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) rev. 00 rev. 00 september 2010 september 2010 www.seoulsemicon.com www.seoulsemicon.com 9. precaution for use (1) storage in order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desicator) with a desiccant. otherwise, to store them in the following environment is recommended. temperature : 5oc ~30oc humidity : maximum 70%rh (2) attention after open. led is correspond to smd, when led be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. attention in followed; keeping of a fraction temperature : 5 ~ 40oc humidity : less than 10% (3) in the case of more than 4 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60 5oc. (4) silver plating might be tarnished in the environment that contains corrosive gases and materials. also any product that ha s tarnished lead might be decreased the solder-ability and optical-electrical properties compare to normal ones. please do not expose the product in the corrosive environment during the storage. (5) any mechanical force or any excess vibrat ion shall not be accepted to apply during cooling process to normal temperature after soldering. (6) quick cooling shall be avoided. (7) components shall not be mounted on warped direction of pcb. (8) anti radioactive ray design is not considered for the products. (9) this device should not be used in any type of fluid such as water, oil, organic solvent etc. when washing is required, ipa should be used. (10) when the leds are illuminating, operating current should be decided after considering the ambient maximum temperature. (11) the leds must be soldered within seven days after opening the moisture-proof packing. (12) repack unused products with anti-moistur e packing, fold to close any opening and then store in a dry place. (13) the appearance and specifications of the product may be modi fied for improvement without notice.
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) rev. 00 rev. 00 september 2010 september 2010 www.seoulsemicon.com www.seoulsemicon.com 10. handling of silicone resin leds (1) during processing, mechanical stress on th e surface should be minimized as much as possible. sharp objects of all types should not be used to pierce the sealing compound. (2) in general, leds should only be handled fr om the side. by the way, this also applies to leds without a silicone sealant, sinc e the surface can also become scratched. (3) when populating boards in smt produc tion, there are basically no restrictions regarding the form of the pick and place nozzl e, except that mechanical pressure on the surface of the resin must be prevented. this is assured by choosing a pick and pl ace nozzle which is larger than the led?s reflector area. (4) silicone differs from materials conventionally used for the manufacturing of leds. these conditions must be considered during the handling of such devices. compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. as mentioned previously, the increased se nsitivity to dust requires special care during processing. in cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) ssc suggests using isopropyl alcohol for cleaning. in case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. ultrasonic cleaning is not recommended. ultr asonic cleaning may cause damage to the led.

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